conduction cooled vpx. 0, 2. conduction cooled vpx

 
0, 2conduction cooled vpx  The DK3 allows fast backplane replacement and conversion between air and conduction-cooled slot inserts

The XChange3012 supports an. NXP QorIQ T2080 Processor-Based Conduction- or Air-Cooled 3U VPX SBC. 62H. Power and reset LEDs are provided for system status. It supports up to two 0. The Ruggedized Enhanced Design Implementation (VPX-REDI) lays out the mechanical design requirements for forced-air cooling, conduction cooling, and liquid cooling in VPX modules, providing detailed. 0 Serial: 2 RS-232/422/485 SATA: 4. 1/2 ATR, conduction-convection cooled. LoC3U-510 Extends System Cooling Capacity. 8&quot; conduction cooled VPX power supplies, built to satisfy the most challenging application requirements while providing up. 0 in. 97"H Chassis Cooling: Conduction-Cooled, Natural Convection-Cooled. Conduction-Cooled. The system leverages LCR’s 600 Series AoC3U-620 chassis for VITA 48. VPX plug-in LFT modules use liquid flowing through an integral heatsink of the module for cooling the circuit board. The development kit includes the cables needed to connect the XPand6200. (L) x 4. 85" or 1. Form Factor. It is available in commercial air-cooled and ruggedised versions up to and including conduction cooling. Accessories. It is designed for use in deployed industrial and military applications in harsh environments. Ethernet Features Built around a non-blocking core fabric, the VPX3-652 supports a wide range of network features, including:Files (3) VPX VITA CARD 3U /. OpenVPX (VITA 65. It features dual 9 slot backplanes including PSU slots. Conduction-Cooled Assemblies (CCA) adaptor (EuropacPRO/-rugged, VPX/CompactPCI) *The price shown is the per piece price and does not include VAT. Built with aero-grade aluminum, the chassis are suitable for rugged onboard/mobile applications and can operate under extreme temperatures, dust and humidity. Boards are inserted in the back of the chassis in a vertical orientation. CCG-6860 Conduction Cooled Card Guide. This platform supports up to eight 0. Standard heatframe components provided represent a high<br /> performance Thermo-Mechanical design, and reduces engineering and<br /> fabrication costs associated with customization. 5th Generation Intel® Core™ i7 (Broadwell-H) Processor-Based Conduction- or Air-Cooled 3U VPX-REDI SBC with SecureCOTS™ The XPedite7572 single board computer is an optimal choice for computationally-heavy applications requiring maximum data and information protection. VPX MEDIA CONVERTER MODULE SUMMARY CF-020010-57X 57X Block Diagram VITA 48. ,Ltd. 1 file(s) 861. 8-inch and/or 1. 5"L x 5. Part of our LoC3U-500 Series of liquid cooled enclosures, the LoC3U-510 is an ATR chassis designed to maintain safe operating temperatures for high power 3U VPX conduction cooled systems. The panels on both the front and rear slots are removable for ease of probing and debugging. 6U VPX boards and utilizes RTMs to simplify I/O access and support rapid system prototyping. A brief low intensity electric current is applied to individual nerves, with recording. Type: Conduction Cooled Assembly VPX. All modern operating. Rugged 3U VPX graphics & GPGPU card based on the NVIDIA Turing architecture using the NVIDIA Quadro RTX 5000 GPU with single-link DVI and DisplayPort™++ outputs. These PSUs are available in 3U or 6U form factor. It provides guidelines for constructing the frame, which is an essential part of the conduction-cooled module’s thermal. FPGA Family. 8-2017, “Mechanical Standard for Electronic VPX Plug-in Modules Using Air Flow Through Cooling,” is a bit long-winded, but it’s essentially an air-cooled standard. . ] Air-over-conduction design. Desk-top chassis for 6U VPX cards (WxDxH: 350x435x593mm) For five front cards and RTMs with a card width of up to 1. VITA 62 Compliant 3U VPX power supply. Data Plane. pitch conduction-cooled VPX (VITA 48. High Performance Embedded Computing. . The XChange3001 is a 3U VPX-REDI carrier module supporting a single-width XMC card. Intel® Xeon® D-1500 Processor-Based Rugged Small Form Factor (SFF) COTS System with Xilinx Kintex® Ultrascale™ FPGA. 3U VPX-REDI conduction-cooled form factor; Dimensions: 100 mm x 160 mm; 0. Keying for Conduction Cooled VME64x: This standard is an extension of the VME64x Standard, ANSI/VITA 1. The SBC3511 is the first of several new single board computers – 3U and 6U VPX - based on Intel’s latest processor that will be launched in the coming months. VITA 91 high-density connectors allow for a completely switched backplane. The D575. This system supports standard SBC and switch modules, as well as VITA 67 modules, making it the ideal platform for high-performance RF applications. VP32004 is a high-performance PC-based 3U VPX processor board developed by Linkedhope®. Cooling air flows directly over the board. It is designed to accommodate best-in-class 3U CMOSS and SOSA aligned payloads to meet mission needs with minimal time to theater. OpenVPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system environments. AoC3U-210: air over conduction cooled 2 slot 3U VPX ATR chassis for 3U VPX and SOSA aligned plug in card payloads. Each DCM has 3Commercial Air-Cooled. 1) modules. , a leading supplier of conduction cooled VPX systems, has been awarded by a prime contractor based in Maryland, to deliver DesertGecko 3U VPX systems based on Juniper Networks LN 1000 router and PCI-Systems managed conduction cooled Gigabit Ethernet switch. Talk to a Hartmann representative today about compliance and your power needs. 59"L x 4. Elma Bustronic Corp. 2 based. 2 Type 2, Secondary Side Retainer. With both air-cooled and conduction-cooled boards and. The heat from the internal conduction-cooled modules is conducted to sidewall exchangers, where it is dissipated to the ambient environment by forced-air cooling. The logic-optimized FPGA is well-suited for a. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3. Shock: 40G peak for conduction-cooled; Dimensions: 160mm x 100mm x 25. com Technical Specs Accessories Documentation Block Diagram The XPand1200 is a low-cost, flexible development platform, supporting up to eight 0. The XPand1201 is a low-cost, flexible, development platform. Development chassis and accessories for VPX and SOSA aligned module payloads to support every stage of product development. 2 struggles to dissipate the attendant heat using straight conduction cooling – leaving system designers with only two choices; move to VITA REDI alternatives or stick with VITA 48. Intel® Xeon® D-1700 Processor-Based Rugged. In its default configuration, the XPand6200 Series Development Kit includes the XPand1508 I/O breakout stations. AFT relies on a heat frame that clamshells onto the entire board’s electronics. The AcroExpress ® VPX6600 is a high-performance 3U OpenVPX TM embedded single board computer based on the 6th Generation Skylake Intel ® Xeon ® E processor and PCH. 3V, 5V, +12V_Aux,ANSI/VITA 48. The XPand1004 system is a low-cost development platform for conduction-cooled 3U VPX cards. Output over-voltage, over-current, and over-temperature. Fast backplane replacement makes. 2 mechanicalformat. A conduction-cooled option is available for more rugged operating environments. Convection (air) and conduction with extended temps. 3A/37A (normal/peak inrush current)performance leaps relative to VME and early VPX systems of just a few years ago. Zynq Ultrascale+. ANSI/VITA Stabilized. Two-Slot 6U VPX Development Platform for Conduction-Cooled Modules with RTM I/O. manufactures and sells Power Supplies for various COTS architecture systems to include custom and standard designs. 11-1019958-x4 = Conduction cooled version 47915 Westinghouse Drive, Fremont, CA 94539 phone 510-657-4444 fax 510-657-3274 [email protected]″ form factor. Removable drive modules rated for 100,000 mating cycles. or 1. Length: 160 mm. 8x D1 Video Frame Grabber 3U VPX card. ANSI-VITA 48. VX3060-S2 Rugged Air cooled variant is designed to meet VITA 47 class EAC6 V2 and can operate in extended temperature environ-ments up to of -40 °C/+70 °C. Integrated security features for reliable, secure data transmission. This extensive line includes conduction cooled VPX, air cooled VPX, as well as VPX ATR configurations. XIt1083. VITA 62 power connector. VPX 3U/AC Power Supply 600W. Abaco’s SBC3612D rugged 3U VPX single board computer delivers the highest performance you can get in a 3U Intel® base. AFT for VPX is supported with variations (“dot specifications”) through VITA 48. The patented Isothermal Card Edge ICE-Lok ® is designed to enhance thermal performance for conduction-cooled embedded computing systems. Created Date: 3/20/2017 10:06:58 AM. 100 Ohm differential pair routing. EIZO. Software. 0, 2. Sub-½ ATR, Conduction-Cooled Chassis for Conduction-Cooled Modules. Of the two VPX mechanical form factors, 3U is very popular in certain applications, and 6U is sometimes necessary to build highly parallel systems with optimal computing density. Five slots 3U VPX conduction cooled Chassis. 0 Ruggedized Enhanced Design Implementation. 2 Type 2, Secondary Side Retainer. Cisco ESR6300 with two routed, four switched Gigabit Ethernet interfaces. Frame has injector/ejector latches for plug-in card. High performance 3U or 6U single board computers feature air or conduction-cooled options. Rugged Conduction Cooled Assemblies and Modules Conduction Cooled Assemblies and Modules Conduction Cooled Keys Systems and Components. Configure your PCB Wedge Lok. 35mm X 160mm] for circuit Boards & plug-in units with AIR or Conduction cool mechanism The base Mechanical specifications of PCB & Plug-In units are defined by VITA46 The Allowable Standoff Height for PMC/XMC is 10mm where 0. 4. 8 in. Product Features. Standard Air- and Rugged Conduction-Cooled Versions; Download Datasheet Request information Add to compare. Learn more about the AcroExpress VPX SBC and see all VPX models. Accessories Documentation Block Diagram The XPand1004 system is a low-cost development platform forconduction-cooled 3U VPX cards. The Atom™ E3800 processors provide excellent computational performance and I/O functionality for. This fully-defined, backplane-centric VPX module optionally supports either commercial GNSS receivers (i. Block Diagram. 1x 100GBase-KR4, 1x 10/25GBase-KR. Form Factor: Custom Chassis Type: Custom. 2, 2022 Edition, 2022 - Mechanical Standard for Conduction Cooling VPX. Integrated Conduction Cooled Assembly Designed for rugged conduction cooled assemblies (CCAs) in VPX systems, the High Thermal Integrated CCA design innovatively. 2-Slots of 3U VPX on 1″ pitch (OpenVPX Ready) Integrated intelligent Power Supply provides up to 400 Watts of 6-channel power. Technical Specs Accessories Documentation Block Diagram The XPand1200 is a low-cost, flexible development platform, supporting up to eight 0. pitch with solder-side cover; Environmental Requirements. Level 1-5 Air, Conduction Cooled. Supported ruggedization levels (see the X-ES. The XChange3031 provides one backplane 40GBASE-KR4 Ethernet port, six backplane 10GBASE-KR. Description: The XPand1203 is a low-cost, flexible, development platform. This short 1/2 ATR ships with a 6-slot OpenVPX™ backplane and can accommodate other architectures such as 3U CompactPCI® and MicroTCA™. Products. VPX 3U. Both XMC and PrPMC interfaces are active simultaneously. The LoC-600 is an ATR chassis designed to maintain safe operating temperatures for high power 3U VITA 48. 11/SOSA-aligned and utilizes a Xilinx UltraScale+ ZU5EG MPSoC. 5, and Vulkan 1. ANSI/VITA 48. Sub-½ ATR, Conduction-Cooled Chassis for Conduction-Cooled Modules. Conduction cooled version: -40°C to +75°C at wedge locks (+85°C optional) Air cooled version: -40°C to +75°C Storage Temp. Real-time video feedback for remote platforms ; Unmanned vehicles (UAV, ROV) Real-time IP video distribution. The liquid-cooled chassis sidewalls will. It features a FMC+ slot. Block Diagram. The rugged. Combined with IC’s ComEth4582a 10 Gigabit Ethernet router or hybrid ComEth4410a switch (PCIe & Ethernet) and other IC’s Processor/FPGAs boards with. The XChange3031 is a conduction-cooled 3U VPX Ethernet switch module. 2 Conduction. 3U VPX VITA 67 Development Platform for Conduction-Cooled RF Modules and Intel® Core™ i7 Processor-Based Module The XPand1202 provides a low-cost, flexible, VITA 67 development platform. 2 conduction cooled modules. Conduction-Cooled Option. View. 3U conduction-cooled VPX Ethernet router. 0-inch pitch • Meets VITA58 specification with multiple sizes availableCooling. • Air cooled (5332) and conduction cooled (5333) configurations with optional conformal coating and extended temperature operation • 5332 Supports 1 drive in 4HP slot with no REDI coversTR E5x/msd -RCx is a rugged conduction cooled 3U VPX™ board optimized for Size, Weight and Power (SWaP). 2. The XPand1303 is a low-cost, flexible, development platform. The XPand1201 is a low-cost, flexible, development platform. 8 in. Conduction-cooled VPX enclosures with liquid assist. The AoC3U-400 Series of chassis use leading edge technology to manage high heat dissipating board payloads. The XPort3305 is a conduction-cooled dual 10 Gigabit Ethernet XMC with front and rear panel I/O support. TR E8x/msd-RCx – Rugged 3U VPX Processor. With multiple high-speed fabric interfaces, x8 PCI Express Gen3, 12 high-speed fiber-optic transceivers, and 8 GB of DDR4-2400 SDRAM in two channels, the. 3V auxiliary Parallel operation capable with proprietary wireless. nVent SCHROFF offers you a wide range of Card. XIt1086. Provides up to an 8-slot system for 3U convection cooled boards and 3U transition modules on 1. 2-2020: Mechanical Specification for Microcomputers Using REDI Conduction Cooling Applied to VPX; This Standard defines the mechanical requirements that are needed to ensure the mechanical interchangeability of conduction cooled 3U and 6U Plug-In Modules and defines the features required to achieve Two. Form Factor: VPX Size: 3U. This dual-port Ethernet XMC card is designed and tested to VITA 47 environmental standards for air-cooled or VITA 20. ANSI/VITA Stabilized Maintenance. Hartmann Electronic VPX Standard Chassis are designed to allow any COTS or customer spec configuration in either 3U or 6U form factor taking into account a wide range of. The specification of 6U VPX calls for computer cooling via a conduction-cooled envelope compliant with the IEEE standard IEEE-1101. 8 in. 25 GHz, the MPC8640D delivers. 3U VPX-REDI conduction- or air-cooled form factor; Dimensions: 100 mm x 160 mm; 0. Conduction-cooled modules include an additional 10/100Base-TX port available on the rear VPX connector. 2775 Laurel Street Vancouver, BC V5Z 1M9. VENRAY, the Netherlands July 21st 2010 - VSN Systemen bv, a leading telecom hardware and software developer, launches OpenTSP NG technical building blocks,which are essential for the development of the newest multimedia applications. CCE-3VX4 Conduction Cooled Enclosure for 3U Modules › 4 slots of 3U VPX on 1" pitch (Open VPX Ready) › Integrated power supply › RuSH enhanced power supply actively monitors: – Voltage on each power rail – Current on each power rail – Temperature (humidity – optional) › FFM-overlay backplane interconnection for quick turn˚Sub-½ ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules. 3V_Aux. The XPand1203 is a low-cost, flexible, development platform. Data Center Solutions. Eight 6U VITA 48. The RFDC contains two (2), full spectrum, Non-blocking RF Down Conversion Modules (DCMs). 8 in. A common example of this is the conduction cooled chassis mounted onto a cold plate as shown in the below figure. The AcroExpress® VPX6860 is a high performance 6U OpenVPX™ single board computer based on the 6th Generation Intel® Xeon® E processor (formerly Skylake) and PCH. It is designed for use in deployed industrial and military applications in harsh environments. 3U VPX carrier card. 2 / VPX conduction cooled thermal load board module. The internal SATA SSD memory modules combine the convenience of high-capacity off-the-shelf storage with the reliability of solid-state non-volatile memory. The XPedite7672 is an optimal choice for computationally heavy applications. U-Blox), or secure SAASM M-Code GPS receiver. 3U CompactPCI 2. This Model Can be used to design the VITA Card Chassis. With a Core 2 Duo processor at up to 2. VX3060-S2 Rugged Conduction cooled version is a Plug-in unit according to VITA 48. 0 and VITA 65 connector interoperability. The XPand1508 supports two standard VITA 46. The PCIe and Gigabit Ethernet fabrics provide switching for a star topology. 4-Slots of 3U VPX on 1″ pitch (OpenVPX Ready) Integrated intelligent Power Supply provides up to 400 Watts of 6-channel power. It can. Revolutionary design allows for up to 175. Up to 20 CFM of airflow is provided per slot. 3. Component selection, thermal design, and electrical design have all been made with the requirements of high-performance embedded computing at the forefront. 8 Live NTSC/PAL/RS-170 video inputs; 4 x Audio input; 8 x D1 size capture at full frame rate; Conduction cooled 3U VPX module; Overlay frame grabber PAL RS-170 NTSC video capture OpenVPX VPX. Available for use in either AC or DC systems, they are 6U high by 5HP (1-inch) wide modules with guide blocks, for use in VPX systems. 0 VPX Base Standard VITA 46. Commercial off-the-shelf (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. LOWER RISK. 34. Read the full article hereHartmann’s VPX Power Supplies are built for the most rugged applications with quality and reliability in mind. We offer air & conduction cooled power supply units for wide range AC as well as DC input. WOLF’s 3U VPX modules use the 1" pitch allowed in VITA 48 (VPX REDI). Form Factor: 3U VPX. The new cooling standard defines design requirements for platforms that need high performance processing, graphics. e. The XPedite7477 is a high-performance, low-power, 3U VPX-REDI, single board computer based on the 3rd generation Intel® Core™ i7 processor and Intel® QM67 chipset. close. The XPand1015 can be configured as two I/O isolated slots, with all I/O from the payload passed to the RTM. 2 struggles to dissipate the attendant heat using straight conduction cooling – leaving system designers with only two choices; move to VITA REDI. 2 * DDR4 banks (up to 4GB each) The IC-FEP-VPX3d is a 3U VPX FPGA processing board based on a Kintex® UltraScale™ FPGA (KU060, KU085 or KU115). Depending on your processing requirements, XPand3200 Series systems can be populated with high-performance, low-power 3U VPX or 3U cPCI modules designed and manufactured by X-ES. Environment: Extended Temperature, Extended shock & vibration : Height: 10. 1connectors not included 119EXT6024-06XXR 6U VPX Extender 6U - P0 utility, P1, P3 to P6 differential, P2 single ended 119EXT6024-05XXR 6U VPX Extender 6U - P0 utility, P1 to P6 differentialIt includes the complete connector complement under the standard thus enabling streamlined testing of target payloads. Block Diagram. 2 (REDI) and VITA 65 (OpenVPX™). 0 in. VPX Backplane, 3 U, 5 Slots, Full-Mesh, Without RTM. LXH0000523: VPX 3U Load Board - Air cooled: NA. 91 GHz. Conduction cold plates with enhanced material conductivity such as Thermacore’s k-core APG and heat pipe cold plates in the VPX format can be used to design electronic systems with power levels above that possible with pure aluminum cold plates, but can still rely on conduction. 3U VPX Embedded SBCs offering unparalleled performance from cutting-edge Intel or NXP (Freescale) processors & features like integrated FPGAs & SecureCOTS™. Up to 1080p30 or 1080i60. Part of our line of conduction cooled enclosures with air assist, the AoC3U-1400 is designed to maintain safe operating temperatures for high slot. 8 in. WOLF carrier boards are designed to provide system designers with a flexible, highly configurable PCI Express interface. Expansion Plane. The chassis can accept a front and a rear module. -No. 2 and stretch the limits at the. This rugged chip-down VPX card brings the power of NVIDIA and CUDA without a. The sensor platform is based on a 3U, 5-slot, conduction-cooled VPX chassis that houses two Eclipse RXR6322 or RXR6332 receivers, one REF6301 GPS-based reference, one Intel Corei7-based single board computer, and a plug-in. 8 in. Product Features. Also Available: A rugged ATR versionFeatures. It supports up to two 0. Author: Reggie. Part of our AoC3U-800 Series of rugged packaging solutions, the AoC3U-821 enables high slot count systems in a precision engineered chassis for 3U VPX and SOSA aligned plug in card payloads. 3U CompactPCI Development Platform for Up to Eight Conduction-Cooled Modules. LOWER RISK. Both XMC and PrPMC interfaces are active simultaneously. 3U VPX (OpenVPX Compliant) Environmental Specifications Temperature Limits. View product information for IPMI Controller & software for VPX Systems. Our Card and Software Packages are Designed for Fast, Portable Integrations. Embedded RuSH technology actively monitors voltage, current and temperature and talks over system management bus using I2C. 0 Serial: 2 RS-232/422/485 SATA: 6 eSATA. 8 Air Flow Through Cooling; Powerful push-pull cooling of front cards. 6U/ 5HP VPX load card, conduction cooled. See specifications for target performance. For use in DC systems, they are 3 U high by 5 HP (1-inch) wide modules with guide blocks, for use in conduction cooled VPX systems. The logic-optimized FPGA is well-suited. Related standards not addressed in this paper, and specifying conduction cooled implementations for Eurocard, are VITA 48 describing VPX VITA 46 mechanical implementations and VITA 57 dealing with FMC mezzanines. 3 V. OpenVPX, Rugged Conduction or Air Cooled 3U Broadcom XLP432 for VPX Features Eight Core Broadcom XLP432 processors up to 1. 1. Embedded RuSH TM technology. Contact Us. 2 Type 2, Secondary Side Retainer. 1000BaseT. We offer air & conduction cooled power supply units for wide range AC as well as DC input. Hartmann Electronic VPX Standard Chassis are designed to allow any. FEATURES. Our expertise also includes VITA 66,. The heat from the internal conduction-cooled modules is. VITA 48. Three tri-color front panel LED’s to. FPGA Resources. Backplanes are 100% configurable using Meritec cabling allowing. 85 and 1. VPX and SOSA aligned slots may support VITA 66 and. Reviews aren't verified, but Google checks for and removes fake content when it's identified. The PMC-1553 is the Only Commercial Off the Shelf (COTS) Card that Passes and Executes the SAE AS4111/4112. However, as module power continues to increase, VITA 48. The result is a powerful and flexible I/O processor module that is capable of executing custom instruction sets and algorithms. Nerve conduction studies (NCS) are tests used to evaluate the function of the peripheral nerves. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A Technology: VPXVPX336 / VPX340 are State-of-the-art, rugged VITA62 compliant 3U/0. 08 of Vita65. VPX Test Extender 3U 240mm for conduction cooled boards in conduction cooled chassis. 0 in. 3V, 5V, +12V_Aux,State of the Art Power Technology VPX Power Supply. 11 12 V 3. Small and extremely rugged, cold plate base coupled, conduction cooled enclosure measures 9″L x 6″W x 7. A ternary biochar/vanadium pentoxide/graphite like carbon nitride (BC/V2O5/g-C3N4 denoted BC/VO/CN) composite was prepared by a simple hydrothermal method and its. Continuous 580W output over temperature range of-40C to +85C. It is 100GbE-enabled, SOSA-aligned, and highly rugged and thermally. Grabcad 3U Vita Card. Fax: (604) 875-5867. The high-performance VX305C-40G is available in both air-cooled (for lab or other benign deployed environments) and conduction-cooled Plug-in units as per VITA 48. Conduction cooled, ruggedized to MIL­STD­810, with standard conformal coating (other on request) Operating temperature -40°C. It is designed to work as the system controller in command, control, communicate and compute applications and has a wide range of interface and storage options. XIt1086 (90040055) - 3U VPX Rear Transition Module with PCIe, 10 Gigabit Ethernet, eSATA, USB, Serial, and Expandable XIM Sites; XPand1004 (90071810) - Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O; XPand1200 (90070530) - 3U VPX Development Platform for Up to Eight Conduction-Cooled Modules The XPedite7672 is a secure, high-performance, 3U VPX-REDI, single board computer based on the Intel® Xeon® D-1500 family processors. 6U VPX Load Board Forced Air-Cooled Enclosure Two-Slot OpenVPX Development Platform IPv4/IPv6 Gigabit Ethernet Switch 4 0 On the Cover. Clear all Compare. The XPedite6101 supports multiple processor configurations, a number of I/O options, and up. 0, with conduction-cooled and air-cooled versions, provide the assurance of mechanical ruggedization in COTS-based military systems. XPand1007. It supports up to two 0. 2 Type 2, Secondary Side Retainer. 3U VPX-REDI conduction- or air-cooled form factor; Dimensions: 100 mm x 160 mm; 0. The COOL-CC3 chassis is a 6-slot, 3U, VPX, forced-air, conduction-cooled portable tower chassis ideal for lab development. Conduction cooled 3U VPX module; Mechanical. 2 * DDR4 banks (up to 4GB each) The IC-FEP-VPX3d is a 3U VPX FPGA processing board based on a Kintex® UltraScale™ FPGA (KU060, KU085 or KU115). Input: 80 to 264V AC. Compare Products. 5th Generation Intel® Core™ i7 (Broadwell-H) Processor-Based Conduction- or Air-Cooled 3U VPX-REDI SBC with SecureCOTS™ The XPedite7572 single board computer is an optimal choice for computationally-heavy applications requiring maximum data and information protection. Physical Characteristics. The IC-INT-VPX3k is a 3U VPX Single Board Computer built around the Intel® Xeon® W (code name Tiger Lake-H) processor. It is available in air. In support of a variety of test functions, the DK3’s open. 0 standard by specifying additional mechanical details related to the frame construction of conduction-cooled modules. 85 and 1 in. A x8 PCI Express 2. 00730 VITA 62 and MIL-STD compliant 3U DC-DC supply provides up to 360W output power while operating with highest efficiency. PUMA 2509 is an industry standard VITA 62 conduction cooled through wedgelock, VPX power supply. It can operate up to 85 °C card edge temperature according to VITA 47 Product Features. A hybrid switch with 24 ports 32 lane PCI Express Gen 1 / Gen 2 and additional 9 port Gigabit Ethernet switching capabilities provides for highest bandwidth. A momentary push button is provided for reset, and a switch is. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. Single-slot 6U VPX form factor Dimensions: 233 mm x 160 mm x 25.